Apple’s most recent silicon appears to suggest the possibility of connecting numerous M1 Max chips together to form a very powerful multi-chip module (MCM), which would be ideal for a Mac workstation.
The M1 Max contains a die-to-die interconnect on the underside that was not announced by Apple in their official marketing materials at launch, according to YouTuber Vadim Yuryev.
The M1 Max’s second interconnect bus, on the other hand, supports up to four chips. In theory, this interconnect bus may allow for two- or even four-chip M1 Max configurations, raising the already amazing performance of Apple’s most powerful silicon.
You guys seeing this or am I just crazy? The actual M1 Max die has an entire hidden section on the bottom which was not shown at all in Apple’s official renders of the M1 Max die. Just flip another M1 Max and connect it for an M1 Max Duo chip. Then use I/O die for M1 Max Quadra. https://t.co/McWmofJAls pic.twitter.com/JogRwUGvF6December 2, 2021
Is it the “M1 Max Quadra”?
Apple has launched two new high-performance processors in October: the M1 Pro and M1 Max. The latter SoC, which includes a ten-core CPU and a 32-core GPU with 400GB/s memory bandwidth and up to 64GB RAM, is not only the most powerful system-on-chip (SoC) on earth, but it’s also one of the most powerful chips ever created by Apple.
The M1 Pro and Max already offer significant performance increases compared to the previous MacBook Pro generation, according to video-editing experts and others whose job necessitates a high-end mobile workstation.
For comparison, a recent test found that an M1 Max-powered MacBook Pro outperformed a Mac Pro kitted out with a $6,000 GPU for graphical workloads while consuming significantly less electricity.
However, using a chiplet architecture to connect together many M1 Max chips (note that the M1 Pro does not have an interconnect) may provide even more performance growth.
A 12-core, 64-bit Intel Xeon E5 CPU with a Mac Pro powered four-M1 Max configuration, for example, would have a theoretical peak performance of quadruple. To create such a design feasible, Apple would need to acquire an I/O die or fabric interconnect.
Apple has yet to offer any official statements about its plans for the secret M1 Max interconnect.
Subtly charming pop culture geek. Amateur analyst. Freelance tv buff. Coffee lover